LG Innotek has joined hands with Nvidia to develop cutting-edge sensing solutions tailored for physical artificial intelligence (AI) and robotics, accelerating its push into high-growth sectors including autonomous driving and robotic automation.
The South Korean electronic component maker unveiled a new lineup of sensing solutions integrating Nvidia's Holoscan Sensor Bridge (HSB) technology at GTC Berlin in Germany on Oct. 20 (local time). The portfolio features advanced sensing architectures, including a 3-megapixel camera module and a multimodal vision system (MVS) that unifies diverse cameras and sensors into a single framework.
HSB is a high-speed data transfer architecture that routes sensor data directly to an AI computing platform, bypassing the host central processing unit (CPU). By eliminating latency bottlenecks, the technology allows physical AI systems—such as autonomous vehicles and humanoid robots—to process spatial surroundings and make real-time decisions with unprecedented speed. The framework is widely regarded as a critical backbone for next-generation physical AI ecosystems.
Building on this initial showcase, both companies plan to broaden joint development into HSB-powered physical AI sensing applications, spanning vision systems for humanoid robots and dexterity sensing for robotic hands. The partners will co-engineer solutions interoperable with Nvidia's next-generation platforms, targeting public showcases at major global tech stages including CES and GTC next year.
LG Innotek has been accelerating its portfolio expansion into robotics and mobility by leveraging its scalable core capabilities across optical sensing, semiconductor substrates, and electronic control units. The company is actively collaborating with prominent global tech firms such as Aeva and Boston Dynamics, and recently commenced commercial mass production of camera modules for a North American robotics company.
“This collaboration marks a key milestone in scaling our differentiated, multimodal sensing solutions across the global market,” said Moon Hyuk-soo, CEO of LG Innotek. “We will aggressively capture early market leadership as a full-stack physical AI solution provider, offering integrated capabilities that bridge advanced sensing, wireless communication modules, and semiconductor substrates.”
