2026-09-23
Samsung Eyes 10x Faster AI With Stacked zHBM
Samsung Electronics says it is targeting a tenfold increase in AI response speed through zHBM, a proposed 3D-stacked memory architecture that places high-bandwidth memory directly on top of an AI accelerator. Kim In-dong, Executive Vice President for
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TV Chips Overtake LCD Panels in Cost
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Apple Delays Advanced iPhone Display Tech2026-09-23
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Cadence Unveils Faster HBM4E IP for AI Chips2026-09-17
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China Chip Fabs Use 1-in-3 Homegrown Tools2026-09-15
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