Samsung to Add Another 'Wide Fold' Next Year, Expanding Foldables to 5

Samsung Electronics Co., Ltd. will expand its lineup by launching one more 'Wide Fold' model next year, which is currently gaining popularity. The Wide Fold is a foldable form factor whose width is longer than its height when unfolded. This is interp

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  • Samsung and SK Target Yield Improvement with Semiconductor Lab Upgrades

    Samsung Electronics Co., Ltd. and SK Hynix Inc. are massively upgrading their 'analysis labs', which are core infrastructure for semiconductor process improvement and yield management. They plan to introduce next-generation inspection and analysis eq

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  • Upstage, LG, and SKT Advance to Final Stage of Sovereign AI Model Project

    Upstage, LG AI Research, and SK Telecom have advanced to the final stage of the 'Sovereign AI Foundation Model' (Dokpamo) project. Early next year, the final two teams will be selected as 'national AI.' The government plans to pursue the development

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  • LG Electronics and Nvidia to Create 12 Years of Robot Data

    LG Electronics Inc. and Nvidia Corp. will jointly secure a large amount of robot data, equivalent to 12 years, within the year. LG Electronics will accumulate data using hundreds of robots, including 'LG CLOi', and feed it back into robot learning th

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  • LG U+ Brings Live TV+ to Mercedes-Benz S-Class

    LG U+ has partnered with Mercedes-Benz Korea to install its proprietary real-time video service, Live TV+, in the new S-Class. As Mercedes-Benz Korea's official software partner, LG U+ will oversee the service end to end—from development to con

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  • LG Electronics Wins First OSAT Order for LDI Tool

    LG Electronics has secured its first commercial order for a semiconductor laser direct imaging (LDI) lithography system, gaining momentum in a semiconductor-equipment business it has identified as a future growth engine. According to industry sources

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  • TSMC Advances With A16 Backside Power Breakthrough

    TSMC has taken an early lead in angstrom-class semiconductor manufacturing by securing an advantage in backside power delivery for its A16 process, an advanced node below 2 nanometers. The technology is designed to address bottlenecks caused by power

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