LG Electronics has secured its first commercial order for a semiconductor laser direct imaging (LDI) lithography system, gaining momentum in a semiconductor-equipment business it has identified as a future growth engine.
According to industry sources on Aug. 18, LG Electronics' Production Engineering Research Institute (PRI) signed a purchase-order agreement for an LDI system with an outsourced semiconductor assembly and test (OSAT) company. The customer is understood to be a global OSAT provider that also operates semiconductor-packaging facilities in South Korea.
The order marks LG Electronics PRI's first win in the semiconductor-packaging equipment market since it introduced its LDI lithography platform last year. PRI had previously supplied an R&D system to a university, but this is its first purchase order for equipment intended for use on an OSAT company's mass-production line—an indication that the business has moved beyond research applications.
LG Electronics' LDI system is designed for semiconductor packaging. It is used to pattern metal interconnects by using lasers to directly write fine circuit features. Because the maskless process eliminates the photomasks required in conventional lithography, it can reduce both costs and process time.
LG Electronics PRI was established in 1987 as the GoldStar Production Technology Research Institute. It supports manufacturing-productivity improvements across semiconductor, display and battery businesses. PRI previously commercialized LDI equipment for display manufacturing and supplied it to LG Display, then expanded the technology into semiconductor packaging.
For semiconductor-packaging LDI tools, resolution is critical to creating finer line widths and increasing chip density. LG Electronics PRI has introduced an LDI system with 1.5-micrometer resolution and developed additional 3- and 5-micrometer models to address varied customer requirements.
LG Electronics plans to accelerate the business following its first LDI order for semiconductor packaging. It is expected to compete with established LDI-equipment suppliers including Japan's SCREEN Holdings and ORC Manufacturing, as well as U.S.-based Applied Materials.
The company is targeting advanced-packaging equipment as AI-driven demand accelerates semiconductor growth and expands the market for sophisticated packaging technologies. According to the Korea PCB & Semiconductor Packaging Industry Association (KPCA), the advanced-packaging market is projected to grow from USD 51.63 billion last year to USD 90.18 billion in 2030, representing a compound annual growth rate of 11.8%.
Building on experience supplying equipment to LG Group affiliates, LG Electronics PRI plans to actively pursue external customers. LG Electronics believes it has developed a sufficient level of in-house capability in semiconductor-packaging equipment and is now focusing on strengthening its price competitiveness.
Going forward, LG Electronics plans to diversify its semiconductor-equipment lineup with systems for high-bandwidth memory (HBM) inspection and laser equipment for through-glass vias (TGVs) in glass substrates, positioning the segment as a long-term growth business.
